Reading guide :1 month 15 day , first OCP China technology seminar held in Shenzhen , This meeting was held by Tencent Yunhe OCP International community cooperation . At the conference , Cai Kewen, expert engineer of Tencent
stay OCP At the technical seminar, the 《 Tencent cloud T-Flex 2.0 Server framework 》 Speech , The following is the full text of the speech .
Cai Kewen , Responsible for Tencent server architecture design and planning , Combining business requirements and components / system / The technology development of data center and so on , Conduct trend research and product planning .

The development cycle of server is very long , The system development of common rack server often needs 1 More than years , In order to reach the level of mass production delivery . It is inevitable that new components will be imported later , Even the iteration of main function modules ,
for example : Mainboard upgrade , High density microserver module , Full length board , high-density SSD Module, etc . Change based on space and energy consumption , May lead to changes and refactoring of the server principal design ,
Affect the introduction time of server . How to plan space effectively , Support future modular iterations and flexible combinations , Exactly T-Flex 2.0 Server framework should focus on the solution .

Let's look back T-Flex1.0 Server system , Using Tencent operation specifications ,2U19 Inch rack server ,80cm The depth can meet the deployment requirements of Tencent computer room .6 individual 6056 Fan size , Effective support in 35 Degrees centigrade and 3000 Meters above sea level , Multiple configured 5+1 Thermal redundancy . It can be supported structurally 32 individual RSSD perhaps 24 individual U.2
NVMe SSD, At the same time, it can support 4 Zhang quangao full length double width card and 2 Zhang Low Profile Card insertion .

T-Flex1.0 The server system is designed to PCIe Exchange as the core , Elastic configuration expansion or upgrade of storage and incremental servers .2 block Mcirosemi 8536/8546
PCIe The chip provides 192 PCIe
Gen3 Channel capability , Flexible right SSD/GPU/ network card / Microserver and other modules are used for configuration management and combination . Through the PCIe interconnection , Have the ability of decoupling and reconfiguration of hardware resources .

T-Flex1.0 Focus on the combination of capabilities between several servers , and T-Flex2.0 Focus on the aggregation and iteration of its own functions .T-Flex2.0 It is divided into 3 Functional areas :A/B/C. Each area can be based on its own available space , Place different function modules to complete A+B+C, Realize the main function of the server . for instance ,B Area can accommodate a main stream 2 Main board , Or a piece of customization 4 Main board ,A You can place a RSSD module ,C The area can be expanded 4 The sum of double width inserting card of Zhang quangao's whole length 2 Zhang Low
Profile Insert card , A hardware system with both strong computing and high-performance storage is in place .

stay 2U space , provide 24 block 3.5“ System configuration of hard disk , yes T-Flex2.0 The first concrete implementation provided by the framework .A/B Regional support 12 block 3.5“ Hot maintainable hard disk ,C Areas can be provided separately 2 road /1 Road motherboard also has SAS/SATA Expansion board options , support JBOD(Just
Bunch Of Disk) function .

Here is the picture below 2U24HDD Internal structure layout of , Fully embodies A/B/C Of 3 Characteristics of regional assemblage .1 road IntelXeon-D Main board computing power , Meet the needs of cold storage business .2 road IntelCLX a main board , combination 4 block NVMe
SSD, It can meet the needs of data computing and hybrid storage . These configurations are in line with several typical cloud computing business IaaS Scene , It's broken, too 2U12HDD This self 2007 The mainstream form since , Can effectively reduce TCO.

Relative to tradition 2 Access to main board 50cm The depth of ,2U24HDD Of 2 road Intel CLX The depth of mainboard is controlled in 29.5cm,
So that you can put it in T-Flex2.0 Systematic C District space .165W TDP Processor specifications for , signify 20 High main frequency computing power of hard cores .12 The root memory channel can satisfy the 384GB (32GB x
12) Capacity configuration of , Covering most business requirements .

be based on T-Flex2.0 Server framework , Functional modules can achieve high reuse and flexible combination . Module update and iteration of small particles , Also conducive to system integration and timely delivery .T-Flex
2.0 More than the present 89cm The form of system depth , There are also short case forms , By reusing modules and design , To meet the needs of future edge computing scenarios . Hardware system DevOps, Exactly T-Flex2.0 Design main line of .

Background reply “Flex”, Get the whole presentation PDF.

©2019-2020 Toolsou All rights reserved,
Final review of database : Summary of comprehensive application questions use Python Make simple games Laplance operator ( Second derivative ) Convert hard disk to GPT Partition format Python Implementation of Hanoi Tower code about String How to create objects vue3 Learning journey 1—— establish vue3 project java String from back to front _Java String String summary use Python Write a story about plants versus zombies 【 Greedy Algorithm 】 Huffman coding problem